ModICE® Sealed Enclosures: Cinch Connectivity Solutions – ModICE®

ModICE® Sealed Enclosures: Cinch Connectivity Solutions – ModICE®

Cinch Connectivity Solutions ModICE®

ModICE® ME and mini-ME, ModICE® SE, and ModICE® LE

ModICE® is a complete line of connector enclosures that offer sealed packaging solutions for rugged electronic control modules. The ModICE® Advantage – 3 distinct enclosure sizes (ME, SE, LE), Multiple header configurations (18, 30, 48 and 60 I/O), IP67/IP69K and Simple module assembly with snap-in header/PCB.

Features and Benefits

Housings – Glass Filled Polymer

Pins – Bras – Post Tin Plated

Seals – Silicone elastomer

RoHS Compliant

Current 10 Amp @ 85oC

Contact Resistance <10 m Ω

Insulation Resistance >1000 M Ω @ 1000 VDC